尹立孟, 位松, 李望云. 电子封装用低银含量无铅钎料的研究和应用进展[J] 焊接技术, 2011, 40(2):1-5.YIN L M, WEI S, LI W Y. Research and application of low silver content lead-free solder in electronic packaging[J]. Welding Technology, 2011, 40(2):1-5.
WU J, SONG G S, YEH C P, et al.Drop impact simulation and test validation of telecommunication products[A].Inter Society Conference on Thermal Phenomena[C].Piscataway:IEEE, 1998.330-336.
[4]
LIM C T, LOW Y J.Investigating the drop impact of portable electronic products[A].Electronic Components and Technology Conference[C].Piscataway, USA:IEEE, 2002.1270-1274.
[5]
LEE J G, SUBRAMANIAN K N. Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag based solder joints[J]. Journal of Electronic Packaging, 2003, 32(6):523-530.
[6]
SHANGGUAN D K. Analysis of crack growth in solder joints[J]. Soldering & Surface Mount Technology, 1999, 11(3):27-32.
[7]
TU P L, CHAN Y C, LAI J K L. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints[J]. IEEE Components, Packaging and Manufacturing Technology Society, 1997, 20(1):87-93.
[8]
WU J, SONG G S. Drop impact simulation and test validation of telecommunication products[A].Inter Society Conference on Thermal Phenomena[C]. Piscataway, USA:IEEE, 1998.330-336.
[9]
LIM C T, LOW Y J.Investigating the drop impact of portable electronic products[A]. Electronic Components and Technology Conference[C]. Piscataway, USA:IEEE, 2002.1270-1274.
[10]
周新.板级无铅焊点跌落冲击载荷下可靠性分析[D].上海:上海交通大学, 2007.
[11]
瞿欣, 娄浩焕.BGA焊点在板级跌落实验中的疲劳寿命估计[J].封装测试技术, 2006, 31(6):2-5. QU X, LOU H H. Fatigue life assessment of solder joints of BGA component in board level drop test[J]. Package & Test Technology, 2006, 31(6):2-5.
[12]
王文. SMT 无铅焊点在随机振动载荷下的可靠性分析[D].上海:上海交通大学, 2010.
[13]
李晓延.金属间化合物对SnAgCu/Cu界面破坏行为的影响[J].机械强度, 2005, 27(5):666-671. LI X Y. Influence of IMC on the interface failure of tin-silver-copper solder joints[J]. Mechanical Strength, 2005, 27(5):666-671.
[14]
DUAN N, SCHEER J, BIELEN J, et al. The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates[J]. Microelectronics Reliability, 2003, 43(8):13-17.
[15]
ZENG K, TU K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology[J]. Materials Science and Technology, 2002, 38(2):55-101.
[16]
FOLEY J C, GICKLER A, LEPREVOST F H, et al. Analysis of ring and plug shear strengths for comparison of lead-free solders[J].Journal of Electronic Materials, 2000, 29(10):1258-1263.
[17]
SALAM B, EKERE N N, RAJKUMAR D. Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation[A]. 2001 Electronic Components and Technology Conference[C]. Oxlando, USA:Institue of Electrical and Electronic Engineers Inc, 2001.471-477.
