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材料工程  2006 

电铸制备铜-石墨复合材料的研究

, PP. 12-15

Keywords: 电铸,铜石墨,金属基复合材料,摩擦,磨损

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Abstract:

在酸性硫酸铜溶液中采用电铸技术制备了铜石墨复合材料。表面活性剂、微粒浓度、电流密度和搅拌速度等工艺条件对微粒含量具有不同的影响。非离子表面活性剂对微粒共沉积具有较好的效果;随着微粒浓度增大,微粒含量也逐渐增大,最后趋于稳定值;电流密度增大使微粒含量降低;搅拌速度增大时微粒含量存在最大值。铜石墨复合材料的硬度和摩擦系数随着微粒含量增大而减小,但是磨损量先是减小而后增大。摩擦过程中纯铜发生粘着磨损,铜石墨复合材料却表现为剥层磨损。

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