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材料工程  2006 

硅烷自组装膜对制备于多孔性基底上导电聚吡咯薄膜性能的影响

, PP. 45-48

Keywords: 硅烷偶联剂,自组装膜,聚吡咯薄膜,多孔性

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Abstract:

采用硅烷偶联剂对在多孔性绝缘Al2O3膜基底上形成的导电聚吡咯(polypyrrole,PPy)薄膜的形貌及导电性能进行了改善,并探讨了硅烷自组装膜与导电PPy薄膜的形成机理。用硅烷偶联剂对Al2O3膜表面进行改性后,形成了与基底牢固结合的硅烷自组装膜,然后通过化学聚合法在自组装膜上制备得到了均匀致密的PPy薄膜。结果表明硅烷偶联剂有效地改善了PPy薄膜的均匀性及其与基底的附着性,电导率从5.4S/cm提高到了16.6S/cm。

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