L Krusin Elbaum,M Wittmer,C Y Ting and J J Cumo.Thin Solid Films,1983,104:81-87.
[2]
M Ostling,S Nygren,C S Petersson,H Norstrom,P Wiklund,R Buchta,H O Blom and S Berg.J Vac Sci Technol,1984,A2:281-290.
[3]
Y Igarashi,T Yamaji and S Nishikawa.JPN J Appl Phys,1990,29:L2337-2342.
[4]
E Budke,J Krempel Hesse,H Maidhof,H Schussler.Sur &Coat Technol 1999,112:108-113.
[5]
朱永法.物理化学学报,1993,9(2):211-217.
[6]
臧建兵.人工晶体学报,1996,25(4):330-334.
[7]
高巧君.磨料磨具与磨削,1991,1(61):2-8.
[8]
Zhu Y F,Zheng B,Yao W Q,et al.Diamond And Related Material s,1999,8(6):1073-1078.
[9]
Zhu Y F,Zheng B,Yao W Q et al.Surface And Interface Analysis,1999,28:254 -257.
[10]
Zhu Y F,Wang L,Yao W Q,et al.Applied Surface Science,2001,171(1/2):143-150.
[11]
ZHU Yong-Fa,WANG Li,YAO Wen-Qing,CAO Li-Li.TheChemical Journal of Chinese Universities(高等学校化学学报),2000,21(8):1269-1272.
[12]
Zhu Y F,Cao L L.Applied surface Science,1998,133:213-220.
[13]
Yongfa Zhu,Li Wang,Wenqing Yao,Lili Cao.The InterfaceDiffusion and Rea ction Between Ti and Si3N4Multilayers Dur-ing Metallization[J].Surfac e and Interface Analysis,in press.
