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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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碳化硅颗粒增强铝基复合材料的无压浸渗反应机理探讨
, PP. 8-11
Keywords: 碳化硅,铝基复合材料,无压浸渗,界面反应,微观组织
Abstract:
为探讨SiCp/Al基复合材料无压浸渗反应机理,利用XPS鉴定了SiC预制体浸渗前沿界面上的反应产物结构.采用HRTEM研究了SiCp/Al基复合材料的界面结构.结果表明,浸渗与未浸渗部分之间的界面上存在MgO.Al2O3和ZnO诸化合物,没有发现氮的化合物.在SiC相与铝相的界面上仅存在MgAl2O相,MgAl2O相几乎连续地包敷在SiC颗粒上.这表明,高温下SiC与熔Al合金接触后,SiC颗粒表面上的SiO2与Al,Mg,Zn诸元素发生了放热反应,从而降低了表面张力,提高了湿润性.促进了自发浸渗.
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