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WO_3-SiO_2复合薄膜的烧结温度–相组成–气敏特性关系

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Abstract:

以钨酸和正硅酸乙酯(tetraethylorthosilicate,TEOS)为原料,采用改进的溶胶–凝胶工艺,在Al2O3基底上制备WO3–SiO2复合薄膜,重点考查复合薄膜的烧结温度、物相组成及气敏性三者之间关系。用X射线粉末衍射仪和场发射扫描电子显微镜表征复合薄膜的微观结构,结果表明在烧结温度为500℃与650℃时,复合薄膜为立方相和正交相混合相,复合薄膜的晶粒尺寸为25~30nm,分布均匀。650℃烧结时,对还原性挥发性有机化合物(volatileorganiccompounds,VOCs)气体中丙酮具有较好的敏感性。750℃烧结时,复合薄膜只有单一的正交相,晶粒尺寸在30nm左右,此时复合薄膜对氧化性气体NO2具有很好的敏感性与选择性,最低响应浓度(体积)为10–7,响应时间为2s,恢复时间约为10s。

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