全部 标题 作者
关键词 摘要

OALib Journal期刊
ISSN: 2333-9721
费用:99美元

查看量下载量

相关文章

更多...

TiB2粒径对BN–TiB2复相陶瓷致密化和性能的影响

Full-Text   Cite this paper   Add to My Lib

Abstract:

以平均粒径分别为8.1μm和12.2μm的两种TiB2粉末为原料,通过热压烧结方法制备BN–48%(质量分数)TiB2复相陶瓷,研究了TiB2粉末粒径对复相陶瓷致密化和性能的影响。结果表明平均粒径小的TiB2粉末所制备的复相陶瓷致密化速率更快,致密度更高;在1850℃烧结1.5h后,表观相对密度为95.3%,体积相对密度为83.9%,抗弯强度为85.3MPa,弹性模量为47.2GPa,电阻率为1.4mΩ·cm,673K时的热导率为33.7W/(m·K),298~1373K的平均热膨胀系数为7.2×10–6/K,均优于相同工艺条件下平均粒径大的TiB2粉末所制备的复相陶瓷的性能。

References

[1]  TANEMOTO K, KANI T. Hot-pressed hexagonal boron nitride–alu- minum nitride ceramic composites [J]. Key Eng Mater, 1995, 108–110: 85–96. [2] 王皓, 王为民, 辜萍, 等. 热压烧结固溶复合TiB2–NbB2陶瓷的烧结与性能[J]. 无机材料学报, 2002, 17(3): 703–707. WANG Hao, WANG Weimin, GONG Ping, et al. J Inorg Mater (in Chinese), 2002, 17(3): 703–707. [3] WANG Weimin, FU Zhengyi, WANG Hao, et al. Influence of hot pressing sintering temperature and time on microstructure and mechanical properties of TiB2 ceramics [J]. J Eur Ceram Soc, 2002, 22(7): 1045–1049. [4] LIPP A, SCHWETZ K A, HUNOLD K. Hexagonal boron nitride: fabrication, properties, and application [J]. J Eur Ceram Soc, 1989, 5(1): 3–9. [5] KANAI T, TANEMOTO K, KUBO H. Reaction-bonded boron nitride–aluminum nitride ceramic composites [J]. Jpn J Appl Phys, 1991, 30(6): 1235–1238. [6] HAGIO T, YOSHIDA H. Sintering and crystallization of ground hexagonal boron nitride [J]. J Mater Sci Lett, 1994, 13: 653–657. [7] WANG Weimin, FU Zhengyi, WANG Hao. Fabrication and microstructure of BN matrix composites with electrical conductivity [J]. J Wuhan Univ Technol, 2002, 17: 5–7. [8] 王玉成, 傅正义. TiB2与BN复相陶瓷的渗流模型[J]. 复合材料学报, 2002, 19(1): 50–53. WANG Yucheng, FU Zhengyi. Acta Mater Compos Sin (in Chinese), 2002, 19(1): 50–53. [9] 关振铎, 张中太, 焦金生. 无机材料物理性能[M]. 北京: 清华大学出版社, 2004: 147–148. GUAN Zhenduo, ZHANG Zhongtai, JIAO Jinsheng. Physical Properties of Inorganic Materials (in Chinese). Beijing: Tsinghua Press, 2004: 147–148.

Full-Text

Contact Us

service@oalib.com

QQ:3279437679

WhatsApp +8615387084133