张玉军,张伟儒.结构陶瓷材料及其应用[M].北京:化学工业出版社,2005:27-32.ZHANG Yujun,ZHANG Weiru.Structural Ceramic Materials and Ap-plication(in Chinese).Beijing:Chemical Industry Press,2005:27-32. [2]MULLA M A,KRSTIC V D.Low-temperature pressureless sintering of silicon carbide with aluminum oxide and yttrium oxide additions[J].Am Ceram Soc Bull,1991,70(3):439-443. [3]GUO Xingzhong,YANG Hui.Sintering and microstructure of silicon carbide ceramic with Y3Al5O12added by sol-gel method[J].J Zhejiang Univ Sci,2005,6(3):213-218. [4]郭兴忠,杨辉,王建武,等.YAG引入方式对碳化硅陶瓷烧结特性、力学性能及结构的影响[J].中国有色金属学报,2005,15(4):524-530.GUO Xingzhong,YANG Hui,WANG Jianwu,et al.Chin J Nonferrous Met(in Chinese),2005,15(4):524-530. [5]ZHANG Xiaobo,LIU Ning.Microstructure,mechanical properties and thermal shock resistance of nano-TiN modified TiC-based cermets withdifferent binders[J].Int J Refract Met Hard Mater,2008,doi:10.1016/j.ijrmhm.2008.01.008. [6]WANG Zhi'an,DAI Haiyang,ZOU Yu.Effects of nano TiN addition on the microstructure and mechanical properties of TiC based steel bonded carbides[J].Rare Met,2008,27(1):5-8. [7]LIU N,XU Y D,LI H,et al.Cutting and wearing characteristics of TiC-based cermets cutters with nano-TiN addition[J].J Mater Process Technol,2005,161(3):478-484. [8]郭兴忠,李海淼,朱潇怡,等.SiC/纳米TiN水基复合料浆特性及喷雾干燥[J].无机材料学报,2008,23(6):1211-1215.GUO Xingzhong,LI Haimiao,ZHU Xiaoyi,et al.J Inorg Mater(in Chinese),2008,23(6):1211-1215. [9]NIIHARA K,MORENA R,HASSELMAN D P H.Evaluation of KIc of brittle solids by the indentation method with low crack-to-indent ratios[J].J Mater Sci Lett,1982,1(1):13-16. [10]谭寿洪,陈忠明,江东亮.液相烧结SiC陶瓷[J].硅酸盐学报,1998,26(2):191-197.TAN Shouhong,CHEN Zhongming,JIANG Dongliang.J Chin Ceram Soc(in Chinese),1998,26(2):191-197. [11]刘峰晓,贺跃辉,黄伯云,等.Ti(C,N)基金属陶瓷的发展现状及趋势[J].粉末冶金技术,2004,22(4):236-240.LIU Fengxiao,HE Yuehui,HUANG Boyun,et al.Powder Metall Technol(in Chinese),2004,22(4):236-240. [12]RIXECKER G.,WIEDMANN I,ROSINUS A.High-temperature effects in the fracture mechanical behaviour of silicon carbide liq-uid-phase sintered with AlN-Y2O3additives[J].J Eur Ceram Soc,2001,21:1013-1019.
