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热压烧结对锆钛酸铅镧陶瓷电卡效应的影响

DOI: 10.14062/j.issn.0454-5648.2015.06.04

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Abstract:

探讨热压烧结工艺对PLZT(锆钛酸铅镧)陶瓷材料介电击穿性能、饱和极化强度以及电卡性能的影响。通过X射线衍射和扫描电子显微镜,分析陶瓷样品的相组成和微观结构。结果表明,热压烧结法有助于控制陶瓷晶粒的生长,提高陶瓷的致密度并增大陶瓷的介电击穿场强,从而有效提高陶瓷的电卡性能以及电卡转换效率。在328K(55℃)与478K(205℃)附近,分别发生低温铁电三方相到高温铁电三方相的相变(FRL?FRH)以及高温铁电三方相到立方顺电相(FRH?Pc)的相变,展现了比较好的弛豫性,在室温下达到3.6K的绝热温变与1.8×0?7(K·m)/V的电卡转换效率,具有良好的电卡性能。

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