Nelson L A,Sekhon K S,Fitz J E. Direct heat pipe cooling of semiconductor devices[C]//Proceeding of 3rd International Heat Pipe Conference,London:Oxford,1978:373-376.
[2]
Vemuri S,Kim K J．Pool boiling of saturated FC-72 on nano-porous surface[J]. International Communications in Heat and Mass Transfer,2005,32(1-2):27-31．
[3]
Furberg R. Enhanced boiling heat transfer from a novel nanodendritic micro-porous copper structure[D]．Stockholm:KTH School of Industrial Engineering and Management,2006.
[4]
Kim H,Kim M. Experimental study of the characteristics and mechanism of pool boilling CHF enhancement using nanofluids[J]．Heat and Mass Tranfer,2007,45(7):991-998.
[5]
Phan H T,Caney N,Marty Philippe,et al. Surface wettability control by nanocoating:The effects on pool boiling heat transfer and nucleation mechanism[J]．International Journal of Heat and Mass Transfer,2009,52(23-24):5459-5471.
Kwark S M,Moreno G,Kumar R,et al.Nanocoating characterization in pool boiling heat transfer of pure water[J]．International Journal of Heat and Mass Transfer,2010,53(21-22):4579-4587.
[9]
Sachiko Ono,Noboru Masuda. Evalution of pore diameter of anodic porous films formed on aluminum[J]. Surface and Coatings Technology,2003,169-70:139-142.
