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OALib Journal期刊
ISSN: 2333-9721
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非表面活性剂溶胶凝胶法制备介孔干胶包埋活酵母
DOI: 10.3724/SP.J.1105.2013.12413, PP. 643-648
Keywords: 非表面活性剂溶胶凝胶法,介孔硅材料,活酵母,代谢动力学,干胶
Abstract:
通过非表面活性剂溶胶凝胶法,采用海藻糖和甘油既作为保护剂又作为造孔剂,并使用羟乙基纤维素(HEC)作为添加剂以减轻凝胶过程中的收缩,成功地将酵母原位包埋在具有介孔结构的干胶中,维持了酵母的存活并探索了包埋酵母的代谢动力学与材料孔径参数改良的相关性.选择四乙氧基硅烷(TEOS)和甲基三乙氧基硅烷(MTES)共同作为前驱体,并将湿胶(含水量60%)转变为干胶(含水量10%)以增强材料,部分实现了游离酵母的抑制.通过单轴抗压强度测试说明干胶的单轴压缩强度整体上是湿胶的13倍,最低可达7.13MPa.由平板计数法算得溶胶中的酵母浓度为1.5×108mL-1,折算成干胶粉末则为6.4×108g-1.通过对材料进行比表面积及孔隙分析和代谢动力学表征,发现了包埋酵母的代谢动力学与材料孔径参数的相关性.通过非表面活性剂法制得的干胶的比表面积可达800m2g-1,孔体积可达0.44cm3g-1,孔径可达2.7nm.在此条件下,采用独立取样的统计方法,对无游离酵母的样品点进行代谢动力学表征,包埋酵母60h内可以代谢掉发酵液中89%的葡萄糖.
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