STEPHAN K,PREUΒER P.Waebergang und maximale warmestromdichte beim behaltersieden binarer und terna-rerfl櫣ssigkeitsgemische[J].Chemie Ingenieur Technik,1979,51:34-39.
[2]
TUCKERMAN D B,PEASE R F W.High-performance heat sinking for VLSI[J].IEEE Electron Device Lett,1981,EDL-2(5):126-129.
[3]
QU Wei-lin,GH M M,LI Dong-qing.Pressure-driven water flows in trapezoidal silicon microchannels[J].InternationalJournal of Heat and Mass Transfer,2000,43(3):353-364.
[4]
WU H Y,CHENG Ping.Friction factors in smooth trapezoidal silicon microchannels with different aspect ratios[J].International Journal of Heat and Mass Transfer,2003,46(14):2519-2525.
[5]
QU Wei-lin,GH M M,LI Dong-qing.Heat transfer for water flow in trapezoidal silicon microchannels[J].InternationalJournal of Heat and Mass Transfer,2000,43(21):3925-3936.
[6]
SHAHR K,LONDON A L.Laminar flow forced convection in ducts,supplement 1 to advances in heat transfer[M].NewYork:Academic Press,1978.
[7]
STEINKE ME,KANDLIKAR S G.Single-phase liquid friction factors in microchannels[J].International Journal of ThermalSciences,2006,45(11):1073-1083.
[8]
刘志刚.微细通道内流动与换热可视化实验研究与分析[D].北京:中国科学院工程热物理研究所,2005.LIU Zhi-gang.Visual study and analysis on flow and heat transfer in microchannel[D].Beijing:Institute of EngineeringThermophysics,Chinese Academy of Science,2005.(in Chinese)
[9]
INCROPERA F P,DEWITTD P.Introduction to heat transfer[M].New York:John Wiley and Sons,1996:423-427.
