全部 标题 作者
关键词 摘要

OALib Journal期刊
ISSN: 2333-9721
费用：99美元
投递稿件

查看量下载量

相关文章

更多...

软金属球精密/超精密镜面抛光工艺

Keywords: 铝合金球,研抛参数,表面质量,表面粗糙度

Full-Text   Cite this paper   Add to My Lib

Abstract:

为了探究软金属球精密超精密加工的新途径,采用精密/超精密镜面抛光技术,对其进行镜面抛光实验.实验结果表明:研抛压力、抛光液的pH值、磨粒大小和研抛垫的厚度是影响表面加工质量的主要因素.当研抛压力在0.6~0.8N/cm2、抛光液pH值为10、磨料粒度为W0.5、研抛垫厚度为2mm时,抛光效果最佳,可以有效地提高加工效率,改善表面加工质量,得到表面粗糙度Ra为0.039μm的已加工表面.

 References

[1]  张伟, 李洪玉, 金海. 气囊抛光去除函数的数值仿真与试验研究[J]. 机械工程学报, 2009, 45(2): 308-312.
[2]  ZHANG Wei, LI Hong-yu, JIN Hai. Research on digital simulation and experiment of removal function of bonnet tool polishing [J]. Journal of Mechanical Engineering, 2009, 45(2): 308-312. (in Chinese)
[3]  关佳亮, 仇忠臣, 赵增强, 等. 钽合金精密镜面研磨工艺的实验研究[J]. 机械设计与制造, 2008, 6(6): 118-119.
[4]  GUAN Jia-liang, QIU Zhong-chen , ZHAO Zeng-qiang, et al. Research on precision mirror grinding technology for tantalum alloy [J]. Machinery Design & Manufacture, 2008, 6(6): 118-119. (in Chinese)
[5]  关佳亮, 张孝辉, 马新强, 等. 铝合金手机外壳超精密镜面加工工艺的实验研究[J]. 制造技术与机床, 2014(2): 21-23.
[6]  GUAN Jia-liang, ZHANG Xiao-hui, MA Xin-qiang, et al. Research on ultra precision mirror machining technology for aluminum alloy mobile phone shell [J]. Manufacturing Technology & Machine Tool, 2014 (2): 21-23. ( in Chinese)
[7]  王黎明, 张心明. 高速研磨中研磨压力对工件表面粗糙度的影响[J]. 长春理工大学学报, 2005, 28(2): 32-33.
[8]  WANG Li-ming, ZHANG Xin-ming. Effect of lapping pressure on machined surface roughness in high speed lapping[J]. Journal of Changchun University of Science and Technology, 2005, 28(2): 32-33. (in Chinese)
[9]  关佳亮, 肖小华, 吴衍才, 等. W鄄Mo 合金精密镜面加工工艺的实验研究[J]. 金刚石与磨料磨具工程,2010, 30(3): 6-9.
[10]  GUAN Jia-liang, XIAO Xiao-hua, WU Yan-cai, et al. Research on precision mirror machining technology for W-Mo alloy[J]. Diamond & Abrasives Engineering, 2010, 30(3): 6-9. (in Chinese)
[11]  关佳亮, 于新爱, 杨朝旭. H62 黄铜精密镜面抛光工艺的实验研究[J]. 金刚石与磨料磨具工程, 2006, 155(5): 97-98.
[12]  GUAN Jia-liang, YU Xin-ai, YANG Zhao-xu. Research on precision mirror polishing technology for H62 brass[J]. Diamond & Abrasives Engineering, 2006, 155(5): 97-98. (in Chinese)
[13]  邹微波, 魏昕, 杨向东, 等. 化学机械抛光过程抛光液作用的研究进展[J]. 金刚石与磨料磨具工程, 2012, 32(1): 53-59.
[14]  ZOU Wei-bo, WEI Xin, YANG Xiang-dong, et al. Research development of the effects of polishing slurry on chemical mechanical polishing process [J]. Diamond & Abrasives Engineering, 2012, 32 (1): 53-59. (in Chinese)
[15]  陈景, 刘玉岭, 王立发, 等. 铝合金CMP 技术分析研究[J]. 微纳电子技术, 2007(11): 1017-1020.
[16]  CHEN Jing, LIU Yu-ling, WANG Li-fa, et al. Analysis and study of CMP technology of Al alloy [J]. Micronanoelectronic Technology, 2007(11): 1017-1020. (in Chinese)
[17]  宋剑锋, 姚英学, 谢大纲, 等. 超精密气囊工具抛光方法的研究[J]. 华中科技大学学报, 2007, 35(1): 104-107.
[18]  SONG Jian-feng, YAO Ying-xue, XIE Da-gang, et al. Study on ultra-precision bonnet tool polishing method[J]. J Huazhong Univ of Sci & Tech, 2007, 35(1): 104-107.(in Chinese)
[19]  KUIRY S C, SEA I S, FEI W, et al. Effect of pH and H2 O2 on Ta chemical mechanical planarization [J]. Journal of the Electro-chemical Society, 2003, 150(1): 36-43.
[20]  LI Y, BABU S V. Chemical mechanical polishing of copper and tantalum in potassium iodate-based slurries[J]. Electrochemical and Solid-State Letters, 2001, 4(2): 20-22.
[21]  吴雪花. 抛光垫特性及其对化学机械抛光效果影响的研究[D]. 大连: 大连理工大学机械工程学院, 2005: 3-28.
[22]  WU Xue-hua. Study on pad properties & effects on proeessing in CMP[D]. Dalian: School of Mechanical Engineering, Dalian University of Technology, 2005: 3-28. (in Chinese)
[23]  方照蕊, 魏昕, 杨向东, 等. 新型抛光垫沟槽及其在化学机械抛光中的作用研究进展[J]. 金刚石与磨料磨具工程, 2012, 32(2): 77-81.
[24]  FANG Zhao-rui, WEI Xin, YANG Xiang-dong, et al. Research progresses on the new groove shapes of polishing pad and their effects on CMP processes[J]. Diamond & Abrasives Engineering, 2012, 32 (2): 77-81. ( in Chinese)

Full-Text

Contact Us

service@oalib.com

QQ:3279437679

WhatsApp +8615387084133