European Parliament and European Council.Directive 2002/96/EC of the European Parliament and of the Council of 27 Jan-uary 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment(RoHS)[J].Offi-cial Journal of the European Union,2003(2):19-23.
[2]
PLUMBRIDGE W J,GAGG C R.Effects of strain rate and temperature on the stress-strain response of solder alloys[J].Journal of Materials Science:Materials in Electronics,1999,10:461-468.
[3]
KIM K S,HUH S H,SUGANUMA K.Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys[J].Materials Science and Engineering A,2002,333(1-2):106-114.
[4]
NOSE H,SAKANE M,TSUKADA Y.Temperature and strain rate effects on tensile strength and inelastic constitutive rela-tionship of SnPb solders[J].Transactions of the ASME Journal of Electronic Packaging,2003,125:59-66.
[5]
SHOHJI I,YOSHIDA T,TAKAHASHI T,et al.Tensile properties of Sn-Ag based lead-free solders and strain rate sensitiv-ity[J].Materials Science and Engineering A,2004,366:50-55
[6]
ANDERSSON C,SUN P,LIU J.Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder al-loy for electronics applications[J].Journal of Alloys and Compounds,2008,457:97-105.
[7]
PANG J H L,XIONG B S.Mechanical properties for 95.5Sn-3.8Ag-0.7Cu lead-free solder alloy[J].IEEE Transactions onComponents and Packaging Technologies,2005,28(4):830-840.
[8]
DAI L H,LEE S W R.Strain rate-dependent punch shear behavior of 63Sn-37Pb solder joints[C]∥Proc Inter-PACK’01,The Pacific Rim/International,Intersociety,Electronic Packaging Technical/Business Conference&Exhibition.Hawai,USA:ASME,2001:1-7.
[9]
LEE S W R,DAI L H.Characterization of strain rate-dependent behavior of 63Sn-37Pb solder using split Hopkinson tor-sional bars(SHTB)[C]∥Proc of the 13th Symposium on Mechanics of SMT&Photonic Structures,ASME InternationalMechanical Engineering Congress&Exposition.New York,USA:ASME,2001:1-6.
[10]
WANG B,YI S.Dynamic plastic behavior of 63wt%Sn37wt%Pb eutectic solder under high strain rate[J].Material Sci-ence Letters,2002,21:697-698.
[11]
SIVIOUR C R,WALLEY S M,PROUD W G,et al.Mechanical properties of SnPb and lead-free solders at high rates ofstrain[J].Physics D:Applied Physics,2005,38:4131-4139.
[12]
胡时胜,邓德涛,任小彬.材料冲击拉伸实验的若干问题探讨[J].实验力学,1998,13(1):9-14.HU Shi-sheng,DENG De-tao,REN Xiao-bin.A study on impact tensile test of materials[J].Chinese Journal of Experi-mental Mechanics,1998,13(1):9-14.(in Chinese)
[13]
ZHU F,ZHANG H,GUAN R,et al.The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni)lead-free solder alloy[J].Microelectronic Engineering,2007,84:144-150.
[14]
LIANG J,DARIAVACH N,CALLAHAN P,et al.Inelastic deformation and fatigue of solder alloys under complicated loadconditions[J].Transactions of the ASME Journal of Electronic Packaging,2007,129:195-204.
[15]
WILDE J,BECKER K,THOBEN M,et al.Rate dependent constitutive relations based on Anand model for92.5Pb5Sn2.5Ag solder[J].IEEE Transactions on Advanced Packaging,2000,23(3):408-414.
CHEN X,CHEN G,SAKANE M.Prediction of stress-strain relationship with an improved anand constitutive model forlead-free solder Sn-3.5Ag[J].IEEE Transactions on Components and Packaging Technologies,2005,28(1):111-116.
