LEE Geon-woong,PARK Min,KIM Junkyung,et al.Enhanced thermal conductivity of polymer composites filled with hybridfiller[J].Applied Science and Manufacturing,2006,37(5):727-734.
[2]
LEE Woong Sun,YU Jin.Comparative study of thermally conductive fillers in underfill for the electronic components[J].Diamond and Related Materials,2005,14(10):1647-1653.
[3]
闫刚,魏伯荣,杨海涛,等.聚合物基复合材料导热模型及其研究进展[J].玻璃钢/复合材料,2006(3):50-52.YAN Gang,WEI Bo-rong,YANG Hai-tao,et al.Research progress in thermal conductivity models of polymer basedcomposite[J].Fiber Reinforced Plastics/Composites,2006(3):50-52.(in Chinese)
[4]
LEWIS T,NIELSEN L.Dynamic mechanic properties of particulate filled composites[J].Journal of Applied PolymerScience,1970,14(6):1449-1471.
[5]
AGARI Y,UEDA A,NAGAI S.Thermal conductivity of composites in several types of dispersion systems[J].Journal ofApplied Polymer Science,1991,42(7):1665-1669.
[6]
ZHAO H F,TANG W Z,LI C M,et al.Thermal conductive properties of Ni-P electroless plated SiCp/Al compositeelectronic packaging material[J].Surface and Coatings Technology,2008,202(12):2540-2544.
[7]
SIM LC,RAMANANS R,ISMAILH,et al.Thermal characterization of Al2O3and ZnO reinforced silicone rubber as thermalpads for heat dissipation purposes[J].Thermochim Acta,2005,430(1-2):155-165.
[8]
李侃社,王琪.导热高分子材料研究进展[J].功能材料,2002,33(2):136-141.LI Kan-she,WANG Qi.Advances in thermal conductive polymeric materials[J].Journal of Functional Materials,2002,33(2):136-141.(in Chinese)
[9]
KUSUNOSE T,SEKINO T,NIIHARA K.Production of a grain boundary phase as conducting pathway in insulating AlNceramics[J].Acta Materialia,2007,55(18):6170-6175.
[10]
HE Hong,FU Ren-li,SHEN Yuan,et al.Preparation and properties of Si3N4/PS composites used for electronic packaging[J].Composites Science and Technology,2007,67(11-12):2493-2499.
