JEDEL Solid state technology association,Board Level Drop Test Method of Components for Handheld Electronic Products JESD22—B111[S],Arlington:JEDEL Solid State Technology Association,2003.
[2]
JEDEC Solid State Technology Association,Subassembly Mechanical Shock JESD22—B110[S],Arlington:JEDEL Sclid State Technology Association,2001.
[3]
TEE Tong-yan,NG Hun-shen,LIM Chwee Teck,et al.Impact life prediction modeling of TFBGA packages under board level drop test[J].Microelectronics Reliability,2004,44(7):1131-42.
[4]
WONG E H,LIM K M,SEAH H,et al.Drop impact test-mechanics and physics of failure[C]//Proceedings of the 4th Electronics Packaging Technology Conference,Piscataway:IEEE,2002.
[5]
周春燕，余同希，李世玮．便携式电子产品的跌落冲击响应-试验、仿真和理论[J]．力学进展，2006，36(2)：239-246．ZHOU Chun-yan,YU Tong-xi,LE Shi-wei.Ricky review of shock response of portable electronic products under drop im- pact-tests,simulations and theories[J].Advances in Mechanics,2006,36(2):239-246.(in Chinese)
[6]
WU Ja-son,SONG Guo-shu,YEH Chao-pin,et al.Drop/impact simulation and test validationof telecommunication products [C]//Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Sys- tems.Piscataway,NJ:IEEE,1998.
[7]
ZHU L.Suhmodeling technique for BGA reliability analysis of CSP rackaging subjected to an impact loading[C]//Pacific Rim/International,Intersociety Electronic Packaging Technical/Business Conference and Exhibition,Kauai,New York: American Society of Mechanical,2001:1401-1409.
[8]
SOGO,T,HARA,S.Estimation of fall Impact strength for BGA solder joints[C]//ICEP Conference Proc.,Japan:IEEE, 2001.
[9]
NG Hun-shen,TEE Tong-yan,LUAN Jing-en.Design for standard impact pulses of drop tester using dynamic simulation [C]//Proceedings of 6th Electronics Packaging Technology Conference,Piscataway:IEEE,2004.
[10]
TEE Tong Yan,LUAN Jing-en,PEK Eric.et al.Novel numerical and experimental analysis of dynamic responses under board level drop test[C]// Proceedings of the 5 th International Conference on Thermal and Mechanical Simulation and Experi- ments in Microelectronics and Microsystems,New York:IEEE,2004.
[11]
TEE Tong-tan,LUAN Jing-en,PEK Eric,et al.Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact[C]//Proceedings 54th Electronic Components and Technology Conference,Las Vegas:NV USA,2004.
[12]
TEE Tong-yam LUAN Jing-en,NG Hun-shen.Development and application of innovational drop impact modeling tech- niques[C]//55th ECTC Conference Proc.Piscataway:IEEE,2005.
