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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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倒装焊底充胶分层与SnPb焊点热疲劳的可靠性
, PP. 1072-1076
Keywords: 倒装焊,底充胶,SnPb焊点
Abstract:
采用实验和有限元模拟,研究了底充胶分层和ＳｎＰｂ焊点的可靠性.结果表明,底充胶分层易发生在芯片／底充胶界面边缘处；当底充胶与芯片粘合强度较弱时,底充胶的早期分层是焊点中裂纹萌生扩展从而导致失效的直接原因；当底充胶与芯片粘合强度较强时,分层可以削弱底充胶对焊点的机械耦合作用,从而影响焊点的热循环寿命,此时,焊点热疲劳裂纹是焊点失效的直接原因.
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