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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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金属间化合物提高陶瓷接头高温性能的作用
, PP. 1213-1218
Keywords: Si3N4陶瓷接头,金属间化合物
Abstract:
研究了连接过程中通过原位形成金属间化合物来提高Ｓｉ３Ｎ４陶瓷接头高温性能的可能性.研究了用Ｔｉ／Ｎｉ／Ｔｉ多层中间层在１０００－１１５０℃温度范围内以过渡液相连接Ｓｉ３Ｎ４陶瓷时Ｔｉ和Ｎｉ层厚度、连接时施加的压力以及连接温度与保温时间等因素对接头组织和强度（包括室温和高温强度）的影响规律.
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