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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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扩散处理对Ag-Cu复合板界面区组织与成分的影响
, PP. 47-51
Keywords: 复合板材,界面,扩散,显微组织
Abstract:
研究了冷轧Ag-Cu层状复合板在扩散处理条件下结合面区域微观组织及成分分布的变化.400及750℃扩散处理可使复合板发生再结晶或晶粒粗化.在750℃扩散处理可导致沿结合面Ag侧形成细晶区,并析出次生相,同时使结合面上出现空洞.随扩散时间延长,细晶区宽度增加,次生相数量增多,空洞也趋于连续分布.
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