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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化
, PP. 439-444
Keywords: SnAgCu钎料,金属间化合物,表面贴装
Abstract:
研究了SnAgCu/Cu和SnAgCu/Ni-P/Cu表面贴装焊点在时效和热循环过程中的微结构及剪切强度的变化结果表明,SnAgCu与Cu的反应速率大于其与Ni-P的反应速率.经长时间时效后,SnAgCu/Cu焊点中SnAgCu与Cu的界面成为弱区,而SnAgCu/Ni-P/Cu焊点的剪切断裂则发生在Ni-P与Cu的界面.热循环过程中两种焊点均产生裂纹且强度下降.长时间热循环后Ni-P与Cu分层脱开,SnAgCu/Ni-P焊点失去强度.
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