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金属学报  2012 

定向凝固多孔Cu热沉传热性能的实验研究

DOI: 10.3724/SP.J.1037.2011.00703, PP. 329-333

Keywords: 热沉,微通道冷却,多孔金属,金属-气体共晶,定向凝固

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Abstract:

利用定向凝固多孔Cu制备了气孔呈定向规则排布的多孔Cu热沉,对沿孔长方向长度20mm热沉的传热性能进行了实验研究.实验结果表明,定向凝固多孔Cu热沉具有优异的传热性能,当气孔率为29%,平均孔径为400μm时,热沉的换热系数可以达到5W/(cm2·K),沿孔长垂直方向将定向凝固多孔Cu切割成沿孔长方向排列的2段后,其换热系数可以提高到\linebreak6.5W/(cm2·K).这说明当定向凝固多孔Cu沿孔长方向的长度较大时,通孔率降低限制了热沉的传热性能.

References

[1]  Li M. Master Dissertation, Tsinghua University, Beijing, 2002
[2]  (李勐. 清华大学硕士学位论文, 北京, 2002)
[3]  Shapovalov V I. MRS Bull, 1994; 4: 24
[4]  Liu Y, Li Y X, Zhang H W, Wan J. Acta Metall Sin, 2005; 41: 886
[5]  (刘源, 李言祥, 张华伟, 万 疆. 金属学报, 2005; 41: 886)
[6]  Liu Y, Li Y X, Wan J, Zhang H W. Mater Sci Eng, 2005; A402: 47
[7]  Zhang H W, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1165
[8]  (张华伟, 李言祥, 刘源. 金属学报, 2006; 42: 1165)
[9]  Li Y X, Liu Y, Zhang H W, Wang X. In: Nakajima H, Kanetake N eds., Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals, 2006: 237
[10]  Zhang H W, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1171
[11]  (张华伟, 李言祥, 刘源. 金属学报, 2006; 42: 1171)
[12]  Wang X, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1075
[13]  (王雪, 李言祥, 刘 源. 金属学报, 2006; 42: 1075)
[14]  Kov′aˇcik J. Acta Mater, 1998; 46: 5413
[15]  Hyun S K, Murakami H, Nakajima H. Mater Sci Eng, 2001; A299: 241
[16]  Ogushi T, Chiba H, Nakajima H, Ikeda T. J Appl Phys, 2004; 95: 5843
[17]  Chiba H, Ogushi T, Nakajima H, Torji K, Tomimura T, Ono F. J Appl Phys, 2008; 103: 013515
[18]  Tane M, Hyun S K, Nakajima H. J Appl Phys, 2005; 97: 103701
[19]  Xie Z K, Ikeda T, Okuda Y, Nakajima H. Mater Sci Eng, 2004; A386: 390
[20]  Xie Z K, Ikeda T, Okuda Y, Nakajima H. Mater Sci Forum, 2004; 449-452: 661
[21]  Mahajan R, Nair R, Wakharkar V, Swan J, Tang J, Vandentop G. Intel Technol J, 2002; 6: 61
[22]  Tuckerman D B, Pease R F W. IEEE Electron Dev Lett, 1981; 2: 126
[23]  Rosa P, Karayiannis T G, Collins M W. Appl Therm Eng, 2009; 29: 3447
[24]  Wei X J. J Electron Packaging, 2004; 126: 60
[25]  Ogushi T, Chiba H, Nakajima H. In: Nakajima H, Kanetake N eds., Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals, 2006: 27
[26]  Chiba H, Ogushi T, Nakajima H. In: Nakajima H, Kanetake N eds., Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals, 2006: 35

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