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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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Fe-Ni新型UBM薄膜的晶圆电镀工艺研究
DOI: 10.3724/SP.J.1037.2012.00229, PP. 1273-1280
Keywords: Fe-Ni合金,电镀,凸点下金属层(UBM),晶圆级封装
Abstract:
利用改良型硫酸盐--氯化物镀液体系,进行了晶圆级Fe-Ni凸点下金属层(UBM)电镀工艺的开发研究.研究了镀液中Fe2+含量、电镀温度及电流密度对镀层成分的影响规律,得到了特定工艺条件下镀层成分控制的完整曲线;测量了不同电镀时间和不同电流密度下的镀层生长速率,为实际生产中控制UBM镀层的厚度提供了依据;利用XRD和TEM对镀层的晶体结构及微观形貌进行了表征;利用滴定、等离子体发射光谱(ICP)等手段,对镀液在生产及静置条件下主盐离子浓度的变化趋势进行了监测,测定了抗坏血酸在镀液体系中与Fe3+的反应能力,提出了镀液的日常维护、保存、调控方案以及Fe3+的抑制方案.
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