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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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铜单晶循环变形饱和阶段疲劳裂纹萌生及表面区域内应力分布的模拟
Keywords: Cu,单晶,循环变形,疲劳裂纹萌生
Abstract:
利用扫描电镜电子通道衬度(SEM--ECC)技术观察了循环变形饱和阶段Cu单晶样品中近表面区域的位错微结构.在样品边缘一些条带状或斑点状呈黑色的位错组织区,利用离散位错动力学方法模拟了该区的位错微观结构,并计算了与此位错微结构相对应的内应力分布.模拟和计算结果表明,黑色区是内应力出现最大值区,即应力集中区,它与驻留滑移带(PSB)中的不均匀变形有关,是疲劳裂纹萌生最可能的位置.模拟和计算结果很好地解释了这一现象.
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