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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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少量硼对Fe-Cu纳米粉粒固溶度的影响
, PP. 807-813
Keywords: 化学还原法,Fe－Cu合金,过饱和固溶体
Abstract:
用化学还原法制备了Fe－Cu过饱和团溶合金粉．Fe－Cu纳米粉中含有少量硼可扩展fcc相的成分范围．合金树体中Fe和Cu的原子比达到41时，主相仍保持fcc结构，Lcc相区的范围可超过采用机械合金化法制备的Fe－Cu合金．对样品的退火处理研究证明Fe－Cu系过饱和固溶合金的fcc相相当稳定．认为Fe－Cu合金的这种行为是由于合金中含有少量硼引起的
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