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OALib Journal期刊
ISSN: 2333-9721
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磁控溅射Cu/Al多层膜的固相反应
, PP. 1-4
Keywords: 磁控溅射,Cu/Al多层膜,固相反应
Abstract:
采用磁场控溅射击技术制备了原子比为21、调制周期Λ分别为20和5nm的Cu/Al多层膜.用X射线衍射（XRD），透射电镜（TEM）和热分析（DSC）等技术研究了多层膜的固相反应.Λ=20nm的多层膜样品中铜和铝膜均沿（111）方向择优生长，加热至145℃时生成α-Cu固溶体，超过191℃时生成γ2-Cu9Al4相.制备态Λ=5nm的样品有α-Cu生成.加热时γ2-Cu9Al4的生成温度显著降低(134℃).测定了Λ=20nm多层膜样品中α-Cu和γ2-Cu9Al4的形成激活能分别为0.56eV和0.79eV,后者与文献值相符.
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