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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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Ti2SnC颗粒增强铜基复合材料的力学性能
, PP. 99-103
Keywords: Ti2SnC,颗粒强化,Cu
Abstract:
用粉末冶金方法制备了一种以三元层状陶瓷Ti2SnC为增强相的Cu/Ti2SnC复合材料,研究了增强相的含量对复合材料的显微结构和硬度、拉伸强度等力学性能的影响.结果有明,Ti2SnC对于铜是一种有效的增强相,当Ti2SnC的体积含量为20%(体积分数,下同)时增强效果最佳,屈服强度和拉伸强度分别达到319MPa和440MPa,是相同工艺条件下制备的纯铜的屈服强度和拉伸强度的4倍和2倍,并保持12%的延伸率.强化是由于铜基体晶粒的细化和位错塞积引起的.
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