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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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Cu晶体内椭球裂纹愈合的三维分子动力学模拟
, PP. 449-451
Keywords: 椭球,裂纹愈合,Cu
Abstract:
采用EAM多体势,用三维分子动力学方法模拟了Cu单晶体内椭球裂纹在加压时的愈合过程.结果表明,加压时椭球裂纹顶端沿(1-11)和(-111)面发射位错环,它们运动到晶体表面就被其像力吸引而在表面湮灭.通过位错环不断发射、运动至表面而湮灭,椭球裂纹内的空腔被逐步“转移”到表面,从而使裂纹不断变小乃至完全愈合;与此同时,晶体表面变得凹凸不平.
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