|
OALib Journal期刊
ISSN: 2333-9721
费用：99美元
|
|
|
|
共晶SnBi/Cu焊点界面处Bi的偏析
, PP. 847-852
Keywords: 共晶SnBi/Cu焊点,偏析,界面反应
Abstract:
利用SEM,TEM,XRD分析了共晶SnBi/Cu焊点经120℃时效7d后界面组织结构的变化.焊点界面处金属间化合物厚度由原来初始态的约2um增至时效态的10um,并且化合物也由原来单一的Cu6Sn5转变为Cu6Sn5和Cu3Sn相.进一步研究表明,在Cu3Sn与Cu之间界面处偏析了大量尺寸约100nm的Bi颗粒.双缺口试样的断裂韧性实验表明,热时效促使焊点断裂韧性快速下降,同时该焊点的断口也由原来初始态的韧性断裂转变为时效后Cu3Sn与Cu界面处的脆性断裂,脆性断裂后一侧断口为鲜亮的Cu表面.在TEM下,通过与220℃/5d时效态纯Sn/Cu焊点相同界面的比较,可以断定引起该焊点失效的原因是Bi颗粒在此界面处的偏析.含Bi无Pb焊料由于Bi在界面析出而引发的脆断将会是微电子器件长期使用中的一个潜在危害.
| [1] | Takemoto T. Jpn Weld, 2000; 69(2): 6
|
| [2] | Winterbottom W 1. JOM, 1993; 45(7): 20
|
| [3] | Morris J W, Freer J L, Mei Z. JOM, 1993; 45(7): 25
|
| [4] | Felton L E, Raeder C H, Knorr D B. JOM, 1993; 45(7): 28
|
| [5] | Melton C. JOM, 1993; 45(7): 33
|
| [6] | Mccormack M. JOM, 1993; 45(7): 36
|
| [7] | Abtew M, Selvaduray G. Mater Sci Eng, 2000; R27: 95
|
| [8] | Tu K N. Acta Metall, 1973; 21: 347
|
| [9] | Tu K N, Thompson R D. Acta Metall, 1982; 30: 947
|
| [10] | Mei Z, Sunwoo A J, Morris J W. Metall Trans, 1992; 23A: 857
|
| [11] | Vianco P T, Erickson K L, Hopkins P L. J Electron Mater, 1994; 23: 721
|
| [12] | Jung K, Conrad H. J Electron Mater, 2001; 30: 1294
|
| [13] | Sunwoo A J, Morris J W, Jr Lucey G K. Metall Trans, 1992; 23A: 1323
|
| [14] | Choi W K, Lee H M. J Electron Mater, 2000; 29: 1207
|
| [15] | Raeder C H, Felton L E, Tanzi V A, Knorr D B. J Electron Mater, 1994; 23: 611
|
| [16] | JESD-A103-B, High Temperature Storage Life, Joint Electronic Device Engineering Council (JEDEC)
|
| [17] | Liu P L, Shang J K. Scr Mater, 2001; 44: 1019
|
| [18] | Liu P L, Shang J K. J Mater Res, 2001; 16: 1651
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|
