|
OALib Journal期刊
ISSN: 2333-9721
费用：99美元
|
|
|
|
Mo粉表面化学镀Cu及其反应机理
, PP. 405-409
Keywords: 化学镀Cu,Mo粉,Cu/Mo复合粉体,反应机理
Abstract:
利用Sn--Pd催化体系在Mo粉表面化学镀Cu制备了Cu/Mo复合粉体,利用XRD,SEM,EDS和XPS对复合粉体的成分及形貌进行了分析.利用XPS分析了Mo粉表面化学镀Cu过程中不同阶段元素价态的变化.解释了化学镀Cu过程中纳米Pd粒子的形成及其对Cu沉积的催化作用.
| [1] | Lu D M. Powder Metall Ind, 2002; 10(6): 30
|
| [2] | (吕大铭. 粉末冶金工业, 2002; 10(6): 30)
|
| [3] | Maneshian M H, Simchi A, Razavi H Z. Mater Sci Eng, 2007; A445-446: 86
|
| [4] | Hwang K S, Huang H S. Mater Chem Phys, 2001; 67: 92
|
| [5] | Gusmano G, Bianco A, Polini R, Magistris P, Marcheselli G. J Mater Sci, 2001; 30: 901
|
| [6] | Raghu T, Sundaresan R, Ramakrishnan P, Ramamohan T R. Mater Sci Eng, 2001; A304-36: 438
|
| [7] | Peng X L. Mater Sci Eng, 1999; A262: 1
|
| [8] | Wang H Q, Li X H, Guo H J, Zhang B, Guo Y X. J Cent South Univ(Sci Technol), 2003; 34: 615
|
| [9] | (王红强, 李新海, 郭华军, 张宝, 郭永兴. 中南大学学报(自然科学版), 2003; 34: 615)
|
| [10] | Sharma R, Agarwala R C, Agarwala V. Appl Surf Sci, 2006; 252: 8487
|
| [11] | Lee W, Yang H J, Reucroft P J, Soh H S, Kim J H, Woo S L, Lee J. Thin Solid Films, 2001; 392: 122
|
| [12] | Shukla S, Seal S, Akesson J, Oder R, Carter R, Rahman Z. Appl Surf Sci, 2001; 181: 35
|
| [13] | Meenan B J, Brown N M D, Wilson J W. Appl Surf Sci, 1994; 74: 221
|
| [14] | Huang H Z. The Surface Chemical Analysis. Shanghai: East China University of Science and Technology Press, 2001: 21
|
| [15] | (黄惠忠. 表面化学分析. 上海: 华东理工大学出版社, 2001: 21)
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|
