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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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混装BGA器件高温老化实验焊点微观组织研究
DOI: 10.3724/SP.J.1037.2012.00759, PP. 831-837
Keywords: 混装焊点,高温老化,微观组织,可靠性
Abstract:
采用有Pb焊料对无Pb焊点球栅阵列(BGA）塑封器件进行焊接,选用再流焊工艺对器件进行混装焊接.对混装再流焊BGA器件分别进行4,9,16和25d的高温老化实验,在老化实验前后不同阶段,使用精密电阻仪对混装BGA器件进行电性能测试,没有发现器件的电性能失效.利用SEM对焊点微观组织的分析发现,混装焊点印制电路板(PCB)侧金属间化合物(IMC)成分为Cu3Sn和Cu6Sn5,BGA焊盘侧IMC成分为Ni-Cu-Sn三元化合物.对焊点两侧的IMC进行厚度测量,结果表明,随老化时间延长两侧的IMC厚度都增大,PCB一侧IMC生长速率明显高于BGA焊盘一侧.此外,有一些焊点内部和界面处出现了富Pb相聚集、IMC破裂、界面裂纹以及空洞等可靠性隐患.
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