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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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液-固电迁移Ni/Sn-9Zn/Ni焊点反极性效应研究
DOI: 10.11900/0412.1961.2014.00402, PP. 93-99
Keywords: 反极性效应,Sn-9Zn焊点,电迁移,界面反应,金属间化合物
Abstract:
研究了230℃,5×103A/cm2条件下液-固电迁移对Ni/Sn-9Zn/Ni线性焊点界面反应的影响.在液-固电迁移过程中,Ni/Sn-9Zn/Ni焊点表现出明显的反极性效应,即阴极界面金属间化合物(IMC)持续生长变厚,并且一直厚于阳极界面IMC.由于排除背应力的影响,Sn-9Zn液态钎料中Zn原子的反常迁移行为归因于其有效电荷数在高温下为正值,即在电子风力作用下Zn原子向阴极界面定向迁移,从而导致焊点在液-固电迁移过程中发生反极性效应.回流焊后,Ni/Sn-9Zn/Ni焊点两侧界面上均生成了较薄的Ni5Zn21层.液-固界面反应过程中(无电流)焊点两侧界面IMC均随时间延长而生长变厚,从而消耗钎料中的Zn原子并使界面处的相平衡发生变化,导致界面IMC由Ni5Zn21转变为[Ni5Zn21+(Ni,Zn)3Sn4].与之相较,液-固电迁移过程中阴阳两极界面IMC的类型一直为Ni5Zn21,并未发生IMC类型的转变.这是由于,在电子风力作用下,阴极界面附近钎料中Zn原子的含量充足,Zn与Ni反应生成Ni5Zn21型IMC;同时,电子风力也阻碍了Zn原子向阳极界面的扩散,从而抑制了阳极界面IMC的生长,导致界面IMC较薄,因此阳极界面也未发生IMC类型的转变.此外,运用反证法进一步验证了Zn的有效电荷数在高温下是正值.
| [1] | Chen C M, Chen S W. J Electron Mater, 1999; 28: 902.
|
| [2] | Gan H, Tu K N. In: Scott N ed., Proceedings IEEE 52nd Electronic Components and Technology Conference (ECTC 2002), San Diego: IEEE, 2002: 1206
|
| [3] | Zhang X F, Guo J D, Shang J K. Scr Mater, 2007; 57: 513
|
| [4] | Zhang X F, Guo J D, Shang J K. J Mater Res, 2008; 23: 3370
|
| [5] | Huang M L, Zhou Q, Zhao N, Liu X Y. J Mater Sci, 2014; 49: 1755
|
| [6] | Huang M L, Zhou Q, Zhao N, Zhang Z J. J Electron Mater, 2013; 42: 2975
|
| [7] | Huang M L, Zhang Z J, Zhao N, Zhou Q. Scr Mater, 2013; 68: 853
|
| [8] | Huang M L, Zhang Z J, Zhao N, Yang F. J Alloys Compd, 2014; doi:10.1016/j.jallcom.2014.08.263
|
| [9] | Liou W K, Yen Y W, Jao C C. J Electron Mater, 2009; 38: 2222
|
| [10] | Wang C H, Chen H H. J Electron Mater, 2010; 39: 2375
|
| [11] | Huntington H B, Grone A R. J Phys Chem Solids, 1961; 20: 76
|
| [12] | Ho P S, Kwok T. Rep Prog Phys, 1989; 52: 301
|
| [13] | Blech I A. J Appl Phys, 1976; 47: 1203
|
| [14] | Tu K N. Phys Rev, 1992; 45B: 1409
|
| [15] | Smolin M D, Frantsevich I N. Sov Phys-Sol, 1962; 3: 1536
|
| [16] | Hsiao H Y, Liu C M, Lin H W, Liu T C, Lu C L, Huang Y S, Chen C, Tu K N. Science, 2012; 336: 1007
|
| [17] | Huang M L, Zhou S M, Chen L D. J Electron Mater, 2012; 41: 730
|
| [18] | Chen C, Tong H M, Tu K N. Annu Rev Mater Res, 2010; 40: 531
|
| [19] | Huang M L, Ye S, Zhao N. J Mater Res, 2012; 26: 3009
|
| [20] | Blech I A, Meieran E S. Appl Phys Lett, 1967; 11: 263
|
| [21] | Chen S W, Chen C M, Liu W C. J Electron Mater, 1998; 27: 1193
|
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