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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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Ni-P消耗对焊点电迁移失效机理的影响
DOI: 10.3724/SP.J.1037.2012.00401, PP. 81-86
Keywords: 电迁移,化学镀Ni-P,界面反应,金属间化合物,失效
Abstract:
研究了Cu/Sn/Ni--P线性焊点在150和200℃,电流密度1.0×104A/cm2的条件下化学镀Ni--P层消耗及其对焊点失效机理的影响.结果表明,在Ni-P层完全消耗之前,阴极界面的变化表现为伴随着Ni--P层的消耗,在Sn/Ni-P界面上生成Ni2SnP和Ni3P;从Ni-P层中扩散到钎料中的Ni原子在钎料中以(Cu,Ni)6Sn5或(Ni,Cu)3Sn4类型的IMC析出,仅有很少量的Ni原子能扩散到对面的Cu/Sn阳极界面.当Ni--P层完全消耗后,阴极界面的变化主要表现为空洞在Sn/Ni2SnP界面形成,Ni3P逐渐转变为Ni2SnP,空洞进一步展形成裂缝,从而导致通过焊点的实际电流密度升高、产生的Joule热增加,最终导致焊点发生高温电迁移熔断失效.
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