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OALib Journal期刊
ISSN: 2333-9721
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软模板合成有序介孔碳材料
DOI: 10.7536/PC131125, PP. 756-771
Keywords: 介孔碳材料,自组装,改性,吸附,催化
Abstract:
有序介孔碳材料由于其较大的表面积、均一的孔径、良好的热稳定性和化学稳定性，广泛应用于吸附、分离、催化以及能量储存等众多领域。与传统的以硅基介孔材料为硬模板的反向复制方法相比，通过嵌段共聚物和聚合物前驱体之间的有机-有机自组装的软模板法简便易行，已成为合成有序介孔碳材料有效方法。本论文综述了介孔碳材料的软模板合成机制、合成方法、功能化及其应用，对合成技术、结构控制、孔径调控以及形貌控制等方面进行了讨论，并探讨了其在吸附、催化、电极材料等领域的应用。
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