OALib Journal期刊
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纳米碳基材料在导电胶黏剂中的应用
DOI: 10.7536/PC150167, PP. 1158-1166
Keywords: 碳纳米管,石墨烯,导电胶,体积电阻率,热导率
Abstract:
具有导电、导热等功能的胶黏剂相对于普通胶黏剂具有更高的应用价值,在电子封装领域已得到了广泛应用,然而其成本受制于高体积含量的贵金属填料而无法有效降低。本文基于这些现状总结和分析了近些年来国内外对于解决这类问题的方法和最新研究成果,发现碳纳米管、石墨烯等纳米碳材料具有优异的力学、导电和导热能力,与金属填料复合可以降低10wt%~20wt%的金属填料含量。特别地,碳纳米管作为一维纳米材料能够作为“桥梁”将导电金属填料相互连接起来,可有效提高胶黏剂的导电能力、热稳定性和力学性能,同时降低填料的导电导热阈值和制备成本。通过聚合物基体(如热塑性与热固性树脂)的优化与选择,胶黏剂的力学性能可得到进一步的改善,以便满足于柔性电子器件的封装要求。另外,我们认为通过化学方法制备纳米粒子高温固化后也可以烧结构筑导电导热网络,提高材料的性能。
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