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基于泄漏电流和红外光谱的复合绝缘子憎水性研究

DOI: 10.13336/j.1003-6520.hve.2015.08.030, PP. 2764-2771

Keywords: 复合绝缘子,憎水性,pH值,泄漏电流,介质损耗角正切值(tanδ,),Fourier变换红外光谱

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Abstract:

为了研究高湿度、持续下雨或大雾对复合绝缘子表面憎水性的影响,将新复合绝缘子分别浸泡在配置好的不同pH值溶液中来模拟这类状况,并采取泄漏电流法和Fourier变换红外光谱相结合的方法进行了分析。研究发现持续浸泡情况下,绝缘子表面的泄漏电流有效值和tanδ随浸泡时间增加而变大;在碱性NaOH溶液中浸泡的绝缘子的表面泄漏电流有效值和tanδ比酸性H2SO4溶液和中性溶液(去离子水和NaCl溶液)的更大。分析红外光谱图谱得到碱性溶液中硅橡胶主链和主要憎水集团的峰面积和最大峰值都比其他溶液中的小,碱性溶液更容易破坏硅橡胶憎水集团的化学键;碱性溶液更容易使绝缘子表面丧失憎水性,而去离子水和中性盐溶液对绝缘子憎水性的影响区别很小。

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