纳米铜晶胞体积弹性模量变化规律的分子动力学模拟
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Keywords: 分子动力学,纳米铜晶胞,体积弹性模量
Abstract:
用分子动力学的方法详细模拟纳米铜晶胞随温度与压强变化的规律,得到了铜晶胞体积弹性模量突变的敏感压强点。模拟结果表明:单晶铜的在压强小于75GPa时体积弹性模量随温度升高而降低,随压强增大而增大;在压强大于75GPa时,体积弹性模量随温度升高而增大,随压强增大而减小。
References
[1] | 孙道恒.王明亮.郑剑铭 微机电系统,(MEMS)的研究进展 [J].-机电技术2003(09)
|
[2] | Craighead H G Nanoelectromechanical systems [J].-Science2000(24)
|
[3] | Ramesham R.Ghaffarian R Challenges in interconnection and packaging of microelectromechanical systems (MEMS) [J].-2000
|
[4] | 陈正隆 分子模拟的理论与实践 [J].-北京:化学工业出版社2007
|
[5] | Fujii T.Akiniwa Y Molecular dynamics analysis for micro notch effects of single crystal silicon thin film [J].-2005
|
[6] | Sun M.Butler W H Application of data driven models in quantum mechanics calculations [J].-2002
|
[7] | Allen M P.Tildesley D J Computer simulation of liquids [J].-Oxford:clarendon Press1987
|
[8] | 冯端 金属物理学 [J].-北京:科学出版社1987
|
[9] | Masao Doyama.Kogure Y Embedded atom potentials in fcc and bcc metals [J].-Computational Materials Science1999(1-4)
|
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