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用于微石英陀螺质量修调的微电镀实验研究

Keywords: 微石英陀螺,机械耦合误差,微电镀,正交实验法,亚硫酸盐镀金

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Abstract:

为了消除微石英音叉陀螺中存在的机械耦合误差,采用了质量修调的方法.运用微电镀工艺在音叉叉指上制作金质量块,通过正交实验,讨论了温度、电流和搅拌速度对电镀质量块粗糙度和厚度的影响,并分析了电镀层厚度与时间的关系,确定了工艺参数,其中温度控制在70℃、电流设定为5mA、搅拌速度设定为900r/min、所需电镀时间为130min.后经过初步激光修调,使得机械耦合误差由1.840V减小到0.132V,提高了陀螺性能.

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