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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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低温等离子体剥蚀-电感耦合等离子体质谱联用对电路板镀层的深度分析
DOI: 10.11895/j.issn.0253-3820.150070, PP. 709-713
Keywords: 低温等离子体,介质阻挡放电,剥蚀,深度分析,电路板,电感耦合等离子体质谱
Abstract:
建立了基于低温等离子体(Lowtemperatureplasma)剥蚀系统将固体样品直接引入电感耦合等离子体质谱(ICP-MS)并用于电路板镀层中Au,Ni和Cu的深度分析。此实验中采用介质阻挡放电(DBD)方式产生低温等离子体探针,逐层剥蚀样品表面,由ICPMS检测元素信号。对DBD所用放电气体种类、外加电场功率、放电气体流速和采样深度等实验条件进行优化。在优化条件下,应用LTP-ICPMS在30s内完成电路板镀层(20μmAu/10μmNi/Cu基底)的逐层剥蚀和深度分析,元素种类和分层顺序与X射线光电子能谱(XPS)相吻合,镀层的分辨率可拓展至微米水平,表明此技术可直接用于固体样品的深度分析。
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