|
OALib Journal期刊
ISSN: 2333-9721
费用：99美元
|
|
|
|
焦磷酸盐电镀铜初始过程研究
, PP. 228-231
Keywords: 焦磷酸盐镀铜,临界起始电流密度,结合强度,XPS,深度刻蚀
Abstract:
应用恒电流法研究了铁基体上焦磷酸盐电镀铜电位时间变化类型与镀层结合强度之间的关系.提出了临界起始电流密度(DKC)概念.当起始工作电流DKI大于DKC时,铁电极首先被极化至铁表面的活化电位,即基体表面被活化,随后极化至铜的析出电位,使铜层沉积在活化的铁基体表面上,形成具有良好结合强度的铜镀层.反之,如DKI小于DKC,则铜层只能在"钝化"的含氧层表面上析出,得到的镀层结合强度很差.由氩离子溅射深度刻蚀和X射线光电子能谱(XPS)检测出结合强度差的镀层和基体间界面含氧层的存在.调整工艺条件,优化了焦磷酸盐直接镀铜工艺,可降低工艺的DKC,得到与铁基体具有良好结合强度的电镀层.
| [1] | ChenCC(陈春成).Anewprocessforcyanidefree copperplating[J].MaterialsProtection,2003,23,(4):10～11.
|
| [2] | WangRX(王瑞详).Alkalicyanidefreecopperelec troplatingonsteelandironsubstrate[J].Materials Protection,2003,36(4):62～63.
|
| [3] | ZhangMS(张梅生),ZhangBQ(张炳乾).Alkalicy anidefreecopperelectroplatingtechnology[J].Materi alsProtection,2004,37(2):37～39.
|
| [4] | WuhanMaterialsProtectionResearchInstitute(武汉材料保护研究所).Quantitativedeterminationofbond ingstrengthbetweencyanidefreecopperelectroplating layerandsteelandironsubstrate[J].MaterialsProtec tion,1973,(1):16～21.
|
| [5] | HuRG(胡融刚),LinCJ(林昌健).XPS/SERS studyofelectrochemicalLymodifiedpassivefilmon stainlesssteel[J].J.Chin.Soc.Corros.Prot.,2000,20(3):149～153.
|
| [6] | SavinovaER,ZemlyanovD,PettingerB,etal.Onthe mechanismofAg(111)sub monolayeroxidation:a combinedelectrochemical,insituSERSandexsitu XPSstudy[J].EletrochimicaActa,2000,46:175～183.
|
| [7] | McGovernWR,SchmutzP,BuchheitRG,etal.For mationofchromateconversioncoatingsonAl Cu Mg intermetalliccompoundsandalloys[J].J.Electro chem.Soc.,2000,147(12):4494～4501.
|
| [8] | WangYing(王瑛),BABAY,SEKIGUCHIT.Effect ofsurfacecompositionofelectrochemicallycodeposited platinum/molybdenumoxideonmethanoloxidation[J].J.Electrochem.Soc.,2001,148(3):C222～C226.
|
| [9] | XianXB(鲜晓斌),LvXC(吕学超),ZhangYB(张永彬).AlcoatingsonUsubstratesbyrepeatedAr+bombardment magnetronsputterionplated(MSIP)[J].CorrosionScienceandProtectionTechnology,2002,14(2):98～99.
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|
