Lupu N.Electrodeposited nanowires and their applications ［M］.Croatia :InTech， 2010:61-64，86，214-215.
[2]
Zhang L D，Fang X S，Ye C H.Controlled growth of nanomaterials ［M］.Singapore :World Scientific，2007:167-175，269-272.
[3]
Huang C C，Lo C C，Tseng Y C，et al.Magnetostructural phase transition in electroless-plated Ni nanoarrays ［J］.Journal of Applied Physics，2011，109(11):113905-1-13905-7.
[4]
Geckeler K E，Nishide H.Advanced nanomaterials ［M］.Weinheim :Wiley-VCH，2010:200-202.
[5]
倪星元，姚兰芳，沈军，等．纳米材料制备技术［M］．北京:化学工业出版社，2007:259.(Ni Xing-yuan，Yao Lan-fang，Shen Jun，et al.Preparation technology of nano material ［M］.Beijing:Chemical Industry Press，2007:259.)
[6]
Wu S S，Liu W L，Tsai T K，et al.Growth behavior of electroless copper on silicon substrate ［J］.Journal of University of Science and Technology Beijing，2007，14(1):67-71.
[7]
Niazi A R，Li S K，Wang Y C，et al.Parameters optimization of electroless deposition of Cu on Cr-coated diamond ［J］.Transactions of Nonferrous Metals Society of China，2014，24(1):136-145.
[8]
任鑫，黄新民，张胡海，等．化学沉积法制备铜纳米管与纳米线［J］．金属功能材料，2006，13(5):1-4.(Ren Xin，Huang Xin-min，Zhang Hu-hai，et al.Fabrication of Cu nanotubes and nanowires by electroless deposition ［J］.Metallic Functional Materials，2006，13(5):1-4.)
[9]
赵文珍．材料表面工程导论［M］．西安:西安交通大学出版社，1998:221-225.(Zhao Wen-zhen.Introduction to materials’ surface engineering ［M］.Xi’an:Xi’an Jiaotong University Press，1998:221-225.)
[10]
胡文彬，刘磊，仵亚婷．难镀基材的化学镀镍技术［M］．北京:化学工业出版社，2003:115-117.(Hu Wen-bin，Liu Lei，Wu Ya-ting.Technology of electroless nickel plating on difficult-to-plate substrates ［M］.Beijing:Chemical Industry Press，2003:115-117.)
