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纯钛TA1和钛合金TC4表面固体渗硼

DOI: 10.3969/j.issn.1005-3026.2014.09.016, PP. 1284-1288

Keywords: 纯钛TA1,钛合金TC4,硼钛化合物,固体渗硼,扩散机理

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Abstract:

采用固体粉末法分别对基体组织为α-Ti的TA1和基体组织为(α+β)-Ti的TC4钛合金表面进行了渗硼,在偏光显微镜和扫描电镜(SEM)下观察了渗层的形貌,用X射线衍射(XRD)分析了渗层的物相组成.实验结果表明,渗硼温度在850~1000℃范围内,TA1表面渗层为平行于基体表面的多层结构,为Ti3O相和TiB相;当渗硼温度高于920℃时TiB为主要组成并出现了TiB2相,且硼钛化合物的含量随温度升高而增加.当渗硼温度低于1000℃时,TC4表面渗层为Ti3O相和TiB相,在渗硼温度高于1000℃时,渗层为TiB2+TiB晶须结构.渗硼温度高于1000℃是TA1和TC4表面形成硼钛化合物的充分条件.

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