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科学通报  2012 

层级仿生微阵列的制备及黏附性能

, PP. 673-681

Keywords: 刚毛,硅橡胶,黏附,层级结构

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Abstract:

采用电火花穿孔技术,制备了直径0.5mm、倾斜度为75°的大孔铜基阴型模板,利用氢硅烷型硅橡胶浇注该模板,得到大直径倾斜阵列,作为一级结构刚毛阵列.接着,采用等离子刻蚀技术制备了3种不同结构(Φ=15,10,5μm)的单晶硅基阴型模板,真空下氢硅烷型硅橡胶浇注,得到3种精细微阵列,作为二级结构刚毛阵列.最后,利用烯硅烷型硅橡胶进行硅氢化反应将二级微阵列键合在一级阵列的支杆末端,得到3种层级刚毛阵列.利用高灵敏力传感器测试了3种层级刚毛阵列的法向、切向黏附性能.结果表明3种层级刚毛阵列的切向滑动黏附力均随滑移距离先增后减,呈现了各向异性的黏附特性;不同二级结构刚毛阵列的切向、法向黏附强度与其二级阵列的直径、密度密切相关.

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