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热挤压态SiCp/AZ91镁基复合材料腐蚀行为研究

DOI: 10.11903/1002.6495.2013.104, PP. 99-112

Keywords: SiCp/AZ91,MMCs,微电偶腐蚀,微观结构

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Abstract:

利用腐蚀失重和电化学测试方法,并结合SEM和TEM分析技术,研究增强相SiC颗粒的体积分数为2%,5%,10%和15%的SiCp/AZ91镁基复合材料(MMCs),在25℃条件下,含有饱和Mg(OH)2的3.5%NaCl溶液中的腐蚀行为。结果表明,SiCp/AZ91MMCs的腐蚀速率明显大于AZ91镁合金,并且随SiC颗粒体积分数的增加而增大。SiC颗粒不与AZ91基体直接构成微电偶,但是SiC颗粒的加入改变了SiCp/AZ91MMCs的显微结构从而提高了腐蚀速率。主要原因为随着SiC颗粒的加入β相晶粒细化,使β相与α相间的微电偶腐蚀电流密度增大;SiC颗粒的加入使大量的β相在SiC颗粒与AZ91基体界面处优先再结晶,致使该界面处β相与α相间的微电偶腐蚀加速,间接导致SiCp/AZ91MMCs的腐蚀加速。

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