Wei Lixiang, Kerkman Russ J, Lukaszewski Richard A. Analysis of IGBT power cycling capabilities used in doubly fed induction generator wind power system[C]. Energy Conversion Congress and Exposition (ECCE), 2010 IEEE Atlanta, GA, 2010: 3076-3083.
[2]
Anzawa Takashi, Yu Qiang. Reliability evaluation on deterioration of power device using coupled electrical thermal-mechanical analysis[J]. Journal of Electronic Packaging, 2008, 132(1): 319-324.
[3]
Takahashi Tomohiro, Qiang Yu. Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-mechanical analysis[C]. Electronics Packaging Technology Conference, Singapore, 2010: 201-205.
[4]
Sasaki Koji, Iwasa Naoko. Thermal and structural simulation techniques for estimating fatigue life of an IGBT module[C]. Proceedings of 20th Internation Symposium on Power Semiconductor Devices&IC’s, Oralando, 2008: 181-184.
[5]
Ye Hua, Lin Minghui, Basaran Cemal. Failure modes and FEM analysis of power electronic packaging[J]. Finite Elements in Analysis and Design, 2002, 38(7): 601-612.
[6]
Chen Yan, Wu Xin, Fedchenia Igor. A comprehensive analytical and experimental investigation of wire bond life for IGBT modules[C]. Applied Power Elec- tronics Conference and Exposition(APEC), Twenty- Seventh Annual Orlando, 2012: 2298-2304.
[7]
郑利兵, 韩立, 刘钧. 基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J]. 电工技术学报, 2011, 26(7): 242-246. Zheng Libing, Han Li, Liu Jun. Investigation of the temperature character of IGBT failure mode based on 3D thermal-electro coupling FEM[J]. Transactions of China Electrotechnical Society, 2011, 26(7): 242-246.
[8]
Bouarroudj M, Khatir Z, Lefebvre S. Temperature levels effects on the thermo-mechanical behavior of solder attach during thermal cycling of power elec- tronic modules[C]. Power Electronics Specialists Conference, Rhodes, 2008: 2435-2440.
[9]
谢鑫鹏, 毕向东, 胡俊. 空洞对功率芯片粘贴焊层热可靠性影响的分析[J]. 半导体技术, 2009, 34(10): 960-964, 1031. XieXinpeng, Bi Xiangdong, Hu Jun. Effects of voids on thermal reliability in power chip die attachment solder layer[J]. Semiconductor Technology, 2009: 34(10): 960-964, 1031.
[10]
徐盛友. 功率变流器状态监测及可靠性评估方法研究[D]. 重庆: 重庆大学, 2013.
[11]
Xiang Dawei, Ran Li. Monitoring solder fatigue in a power module using case-above-ambient temperature rise[J]. IEEE Transactions on Industry Applications, 2011, 47(6): 2578-2590.
[12]
Shinohara Kazunori, Yu Qiang. Fatigue evaluation of power devices[C]. International Conference on Elec-tronic Packaging Technology & High Density Packaging, Beijing, 2009: 1277-1283.
[13]
Hung T Y, Chiang SY, Huang C J. Thermal- mechanical behavior of the bonding wire for a power module subjected to the power cycling test[J]. Microelectronics Reliability, 2011, 51(9-11): 1819- 1823.
[14]
陶文铨. 传热学[M]. 西安: 西安交通大学出版社, 2001.
[15]
孔祥谦. 有限单元法在传热学中的应用[M]. 北京: 科学出版社, 1998.
[16]
金建铭, 电磁场有限单元方法[M], 西安: 西安电子科技大学出版社, 1998.
[17]
Libing Zheng Li Han. Investigation of the Tem- perature character of IGBT solder delamination based the 3-D thermal-electro coupling FEM[C]. Asia-Pacific Power and Energy Engineering Conference(APPEEC), IEEE Power&Energy Society(PES), Chengdu, 2010: 1-4.
陈明, 胡安. 绝缘栅双极型晶体管动态电热联合仿真模型[J]. 电力自动化设备2012, 32(4): 31-34. Chen Ming, Hu An. Dynamic electro-thermal simulation model of IGBT[J]. Electric Power Automation Equipment, 2012, 32(4): 31-34.
[22]
M Bouarroudj, Z Khatir S. Comparison of stress distri- butions and failure modes during thermal cycling and power cycling on high power IGBT modules[C]. Power Electronics and Applications, 2007:1-10
[23]
Nishad Patil, Dignanta Das, Kai Goebel, et al. Identification of failure precursor parameters for insulated gate bipolar transistors (IGBTs)[C]. Inter- national Conference on Prognostics and Health Management, 2008: 1-5.
[24]
周雒维, 周生奇, 孙鹏菊. 基于杂散参数辨识的IGBT模块内部缺陷诊断方法[J]. 电工技术学报, 2012, 27(5): 156-163. Zhou Luowei, Zhou Shengqi, Sun Pengju. Diagnostic method for internal defects of IGBTs base on stray parameter identification[J]. Transactions of China Electrotechnical Society, 2012, 27(5): 156-163.
[25]
W L Anderson, 彭翔. 利用超声波和温度梯度测量金属内部应力的新方法[J]. 天津大学学报, 1988, 2(4): 54-60.
[26]
W L Anderson, Peng Xiang. A new method of stress detection in metals by ultrasound and temperature gradient[J]. Journal of Tianjin University,1988, 2(4): 54-60.
