Charboneau B C, Wang Fei, Wyk Van, et al. Double- sided liquid cooling for power semiconductor devices using embedded power packaging[J]. IEEE Transactions on Industry Applications, 2008, 44(5): 1645-1655.
[2]
曾攀. 有限元基础教程[M]. 北京: 高等教育出版社, 2007.
[3]
Gerstenmaier Y C, Castellazzi A, Wachutka G K M. Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions[J]. IEEE Transactions on Power Electronics, 2006, 21(1): 45-55.
[4]
Lasance C. Special section on compact thermal modeling[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(1): 134-135.
Desai P H, Wiegner G. Evaluation of freon modules for power electronics designed for a locomotive traction drive[J]. IEEE Transactions on Industry Applications, 1990, 26(3): 394-400.
[8]
Liu Xingsheng, Hu M H, Caneau C G, et al. Thermal management strategies for high power semiconductor pump lasers[J]. IEEE Transactions on Components and Packaging Technologies, 2006, 29(2): 268-276.
[9]
Fowler K. Heat transfer and cooling[J]. IEEE Instrumentation & Measurement Magazine, 2001, 4(1): 48-51.
