Xie X L, He Y L, Tao W Q, et al. An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling[J]. Applied Thermal Engineering, 2008, 28: 433-439.
[2]
Sauciuc I, Chrysler G, Mahajan R, et al. Spreading in the heat sink base: phase change systems or solid metals[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(4): 621-628.
[3]
Xiong D X, Azar K, Tavassoli B. High capacity, compact hybrid air cooling system[C]. Thermal and Thermomechanical Phenomena in Electronics Systems-Proceedings of the Intersociety Conference, 2006: 786-790.
Etemoglu A B. A brief survey and economical analysis of air cooling for electronic equipments[J]. International Communications in Heat and Mass Transfer, 2007, 34: 103-113.
[6]
Salem T E, Ibitayo D, Geil B R. Validation of infrared camera thermal measurements on high-voltage power electronic components[J]. IEEE Transactions on Instrument and Measurement, 2007, 56 (5): 1973-1978.
Ozturk E, Tari I. Forced air cooling of CPUs with heat sinks: a numerical study[J]. IEEE Transaction on Components and Packging Technologies, 2008, 31(3): 650-660.
[9]
Malinarič S. Uncertainty analysis of thermophysical property measurements of solids using dynamic methods[J]. International Journal of Thermophysics, 2007, 28(1): 20-32.
[10]
Štofanikl V, Markovič M, Boháč V, et al. RT-Lab the equipment for measuring thermophysical properties by transient methods[J]. Measurement Science Review, 2007, 7(3): 15-18.
[11]
Filicori F, Rinaldi P, Vannini G, et al. A new technique for thermal resistance measurement in power electron devices[J]. IEEE Transactions on Instrumentation and Measurement, 2005, 54(5): 1921-1925.
