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复合材料单搭接胶接接头试验研究与数值模拟

DOI: 10.13700/j.bh.1001-5965.2014.0010, PP. 1786-1792

Keywords: 复合材料层合板,单面搭接,渐进损伤,黏聚区模型,失效模式,应力分析

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Abstract:

针对不同搭接长度和不同被胶接件厚度的T300/QY8911层合板单搭接胶接接头进行了试验研究和数值模拟.建立了不同试验参数下的三维有限元模型,基于Hashin准则和连续介质损伤力学(CDM,ContinuumDamageMechanics)预测层合板面内损伤的起始和演化,应用黏聚区模型(CZM,CohesiveZoneModel)模拟层合板的分层损伤及胶层的失效.系统地研究了接头在不同参数下的失效模式、破坏形貌和极限载荷等的变化,模拟结果与试验吻合良好,验证了有限元分析模型的有效性.通过对接头的破坏形貌和应力分布进一步分析发现,胶接连接的失效模式和极限载荷均与胶接长度和被胶接件厚度有关;模拟接头胶接区在不同加载时刻的应力分布变化,反映了胶接连接在拉伸载荷下的破坏起始和演化过程.

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