Chang C W,Ho C E,Yang S C,et al.Kinetics of AuSn4 migration in lead-free solders[J].Journal of Electronic Materials,2006,35(11):1948-1954
[2]
衣伟,毛书勤.圆柱式通孔导电环装配工艺技术[J].电子工艺技术,2010,31(9):293-295 Yi Wei,Mao Shuqin.Assemble technics of column through hole rotation slip-ring[J].Electronics Process Technology,2010,31(9):293-295(in Chinese)
[3]
Chang C W,Ho C E,Yang S C,et al.Kinetics of AuSn4 migration in lead-free solders[J].Journal of Electronic Materials,2006,35(11):1948-1954
[4]
张会林,张凤山.精密导电环在高速高温真空环境中输电特性研究[J].红外与毫米波学报,2003,22(6):461-463 Zhang Huilin,Zhang Fengshan.Electric transportation properties of the high speed rotation exact electric ring under high temperature and vacuum environment[J].Infrared Millim Waves,2003,22(6):461-463(in Chinese)
[5]
Peng S P,Wu W H,Ho C E,et al.Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni (P) tri-layer structure[J].Journal of Alloys and Compounds,2010,437:431-437
[6]
Roopnarine.A flexible band/geared planetary device for electrical transmissions across continuously rotating Joints[R].AIAA-94-4460,1994
[7]
Vivek Chidambaram,John Hald,Jesper Hattel.Development of Au-Ge based candidate alloys as an alternative to highdlead content solders[J].Journal of Alloys and Compounds,2010,490:170-179
[8]
Chang C W,Ho C E,Yang S C,et al.Kinetics of AuSn4 migration in lead-free solders[J].Journal of Electronic Materials,2006,35(11):1948-1954
[9]
Wu W H,Lin C S,Huang S H,et al.Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) surface finish[J].Journal of Electronic Materials,2010,39(11):2387-2396
[10]
Chang C W,Ho C E,Yang S C,et al.Kinetics of AuSn4 migration in lead-free solders[J].Journal of Electronic Materials,2006,35(11):1948-1954
[11]
Peng S P,Wu W H,Ho C E,et al.Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni (P) tri-layer structure[J].Journal of Alloys and Compounds,2010,437:431-437
[12]
Vivek Chidambaram,John Hald,Jesper Hattel.Development of Au-Ge based candidate alloys as an alternative to highdlead content solders[J].Journal of Alloys and Compounds,2010,490:170-179
[13]
Wu W H,Lin C S,Huang S H,et al.Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) surface finish[J].Journal of Electronic Materials,2010,39(11):2387-2396
