史秀梅,郭菲菲. 电真空器件用焊接材料的发展现状与前景[J].新材料产业,2012(1):16-19 Shi Xiumei,Guo Feifei.The present status and future prospects of brazing materials used in vacuum electron devices[J].Advanced Materials Industry,2012(1):16-19(in Chinese)
刘联宝. 陶瓷-金属封接技术指南[M].北京:国防工业出版社,1990 Liu Lianbao.Ceramic-metal seals technology guide[M].Beijing:National Defence Industry Press,1990(in Chinese)
[4]
王卫杰, 何晓梅.Ag-Cu-Ni焊料在真空开关管中的应用研究[J].真空电子技术,2004(4):45-48 Wang Weijie,He Xiaomei.Study of Ag-Cu-Ni brazing material applied for vacuum interrupter[J].Vacuum Electronics,2004(4):45-48(in Chinese)
[5]
刘联宝. 陶瓷-金属封接技术指南[M].北京:国防工业出版社,1990 Liu Lianbao.Ceramic-metal seals technology guide[M].Beijing:National Defence Industry Press,1990(in Chinese)
[6]
王卫杰, 何晓梅.Ag-Cu-Ni焊料在真空开关管中的应用研究[J].真空电子技术,2004(4):45-48 Wang Weijie,He Xiaomei.Study of Ag-Cu-Ni brazing material applied for vacuum interrupter[J].Vacuum Electronics,2004(4):45-48(in Chinese)
[7]
《电子工业生产技术手册》编委会. 电子工业生产技术手册(4)电真空器件卷[M].北京:国防工业出版社,1990 Manual of Electronic Industry Production Technology Editorial Committee.Manual of electronic industry production technology (4) volume of vacuum electronic device[M].Beijing:National Defence Industry Press,1990(in Chinese)
[8]
《电子工业生产技术手册》编委会. 电子工业生产技术手册(4)电真空器件卷[M].北京:国防工业出版社,1990 Manual of Electronic Industry Production Technology Editorial Committee.Manual of electronic industry production technology (4) volume of vacuum electronic device[M].Beijing:National Defence Industry Press,1990(in Chinese)
[9]
Jacobson D M, Humpston G.Diffusion solder[J].Solder & Surface Mount Technology,1992,4(1):27-32
[10]
Jacobson D M, Humpston G.Diffusion solder[J].Solder & Surface Mount Technology,1992,4(1):27-32
[11]
Zhou Y,North T H. Numerical model for the effect of grain boundaries on the total amount diffusion [J]. Acta Metallurgica et Materialia,1994,42(3):1025-1029
[12]
Zhou Y,North T H. Numerical model for the effect of grain boundaries on the total amount diffusion [J]. Acta Metallurgica et Materialia,1994,42(3):1025-1029
[13]
吴铭方,司乃潮,蒲娟. 铝合金/铜/不锈钢接触反应钎焊及晶界渗透行为分析[J].焊接学报,2009,30(11):85-88 Wu Mingfang,Si Naichao,Pu Juan.Contact reactive brazing between Al alloy/Cu/stainless steel and analysis on grain boundary penetration behaviors[J].Transactions of the China Welding Institution,2009,30(11):85-88(in Chinese)
[14]
吴铭方,司乃潮,蒲娟. 铝合金/铜/不锈钢接触反应钎焊及晶界渗透行为分析[J].焊接学报,2009,30(11):85-88 Wu Mingfang,Si Naichao,Pu Juan.Contact reactive brazing between Al alloy/Cu/stainless steel and analysis on grain boundary penetration behaviors[J].Transactions of the China Welding Institution,2009,30(11):85-88(in Chinese)
