Choi E J, Seo J C, Bae H K, et al. Synthesis and Curing of New Aromatic Azomethine Epoxies with Alkox Side Groups[J]. European Polymer Journal, 2004, 40(1): 256-265
[2]
Lopez. LM, Cosgrove AB. Modeling the vulcanization reaction of silicone rubber. Polym Eng Sci. 2007, 47: 675-83
[3]
Li Hongyan(李鸿岩), Zhou Guanghong(周光红), Zhang Bubeng(张步峰), Jiang Qibin(姜其斌), Zhong Lisheng(钟力生). Study on Cure Kinetics of Solvent-free Silicone Impregnating Varnish[J]. Insulating Materials(绝缘材料), 2010, 43(5): 47-49
[4]
Chen Yongjun(陈永军). Thermosetting Mechanism Study of Poly[(methylsilylene)ethynylene][D]. Beijing: Beijing University of Chemical Technology, 2008: 30-37
[5]
Hong IK, Lee S. Cure kinetic and modeling the reaction of silicone rubber. J Ind Eng Chem. 2013, 19: 42-47
[6]
Zhang Junying(张军营), Zhao Yuan(赵源), Han Yanming(韩燕明), Gu Xiaoli(谷晓昱). Systhesis of a Poly-Vinyl-Silsesquioxanes containing polyhedral oligomeric silswsquioxane molecules[P]: CN, 200710098539.5. 2007-4-20
[7]
Málek J. The kinetic analysis of non-isothermal data[J]. Thermochimica Acta, 1992, 200: 257-269
[8]
Málek J. A computer program for kinetic analysis of non-isothermal thermoanalytical data[J]. Thermochimica Acta, 1989, 138(2): 337-346
[9]
Wang Mingming(王明明). Study of curing process of hexahydrophthalic anhydride/epoxy resin system[J]. Adihesion, 2008, 29(12): 4 -7
[10]
Kissinger H E. Reaction kinetics in differential thermal analysis[J]. Analytical Chemistry, 1957, 29(11): 1702-1706
[11]
Vyazovkin S, Sbirrazzuoli N. Mechanism and kinetics of epoxy-amine cure studied by differential scanning calorimetry[J]. Macromolecules, 1996, 29(6): 1867-1873
[12]
Sbirrazzuoli N, Vyazovkin S, Mititelu A, et al. A Study of Epoxy-Amine Cure Kinetics by Combining Isoconversional Analysis with Temperature Modulated DSC and Dynamic Rheometry[J]. Macromolecular Chemistry and Physics, 2003, 204(15):1815-1821
[13]
VYAZOVKIN S, WIGHT C A. International Reviews in Physical Chemistry, 1998, 17(3): 407-433
[14]
Vyazovkin S. Evaluation of activation energy of thermally stimulated solid-state reactions under arbitrary variation of temperature[J]. Journal of computational chemistry, 1998, 18(3): 393-402
[15]
Vyazovkin S. Modification of the integral isoconversional method to account for variation in the activation energy[J]. Journal of Computational Chemistry, 2000, 22(2): 178-183
[16]
？esták J. Study of the kinetics of the mechanism of solid-state reactions at increasing temperatures[J]. Thermochimica Acta, 1971, 3(1): 1-12
[17]
Sun Manling(孙曼灵). Epoxy resin application theory and technology(环氧树脂应用原理与技术)[M]. Beijing: China Machine Press, 2003: 213-222
[18]
Kim WG, Yoon HG, Lee JY. Cure Kinetics of Biphenyl Epoxy Resin System Using Latent Catalysts[J]. Journal of Applied Polymer Science, 2001, 81(11): 2711-2720
[19]
Kim WG, Lee JY. Contributions of the Network Structure to the Cure Kinetics of Epoxy Resin Systems.According to the Change of Hardeners[J]. Polymer, 2002, 43(21): 5713-5722
[20]
Senum G I., Yang R T. Rational approximations of the integral of the Arrhenius function [J]. Journal of Thermal Analysis and Calorimetry, 1977, 11(3): 445-447
[21]
Koga N. Kineticanalysis of thermoanalyticaldata by extrapolating to infinite temperature[J]. Thermochimica Acta, 1995, 258: 145-159
